SMT组装工艺与焊接前的每一工艺步骤密切相关，其中包括资金投入、PCB设计、元件可焊性、组装操作、焊剂选择、温度/时间的控制、焊料及晶体结构等。

SMT assembly process are closely associated with each process step before welding， including money， PCB design，XP机器配件， component solderability， assembly operation， choice of flux，XP灯源配件， temperature/time， soldering and the control of crystal structure， etc.

供应富士XP142E频闪灯 DEEM5391 原装全新

SMT贴片红胶是一种聚稀化合物，东莞XP，与锡膏不同的是其受热后便固化，其凝固点温度为150℃，这时，红胶开始由膏状体直接变成固体。

SMT patch red rubber is a kind of rare compounds， different from the solder paste is heated after curing， its freezing point temperature is 150 ℃， at this point， the red glue started directly by the paste body becomes solid.